GRAFOL


  • Develop low-cost roll to roll 300mm strip graphene on flex substrate
  • Develop CVD Process conditions/recipes
  • In-situ XPS, TEM to help define process conditions
  • Grain size > 50 µm
  • Transfer

  • Different applications :
  • Building blocks of 3D interconnect technology (vertical and horizontal) (CEA, Intel, CAM)
  • Spintronics (TRT, CNRS)
  • Process for VLSI interconnects (IMEC, UCAM)
  • Hi Freq Optoelectronics (AMO, TRT)
  • Transparent conductive electrodes on GaN LEDS (Phil)
  • Transparent conductive electrodes on OLEDS (Phil)
  • Sensors (CCS)